Aku PCB - PCB Assembly

STORAGE OF SENSITIVE COMPONENTS

Storage requirements for electronic components are steadily increasingly and components are increasingly susceptible to the environment, which requires an integrated sensitive moisture management system. Desiccation cabinets, thanks to desiccation units, maintain a low relative humidity (from 1% to 5% depending on type). Thanks to this low humidity, it is possible to use low temperatures (40°C to 60 °C) which is gentle on both the components and the packaging used (spools, trays, etc.). All components with MSL (Moisture Sensitive Level) from Class 2a to 5a can be safely stored indefinitely in an environment with a vapor content below 1.9 g / m3 according to IPC / JEDEC-J-STD- 033B.1

Maximum humidity: 5%
Oxidation: Corrosion-free in extremely dry environments
Time to reach RH below 5%: Below 5 minutes

ESD PROTECTION AND IONIZATION

Static electricity is generated wherever friction occurs. Electrostatic Discharge (ESD) not only causes fatal or hidden defects in processed electronic assemblies, but can also cause an explosion of flammable gases or par. Ionizers that hang over the workbench where parts are handled give an unparalleled reduction of electrostatic voltage at the EPA (ESD Protected Area) workplace. Ionization of the air also reduces the adherence of dirt where there is a requirement for cleanliness of the production area is required. All our equipment we use meets IPC / JEDEC standard J-STD-033, which defines the handling of ESD components.

Number of ionization units at SMD workplace: 4

PRINTER DEK Horizon 03iX

By means of screen printing, the solder paste (or glue) is printed on the soldering pads via stainless steel template. The shape of the holes is adapted so as not to cause undesirable effects when passing through the brazing furnace. Such as the tombstoning effect or "swimming" of the components on the pads.

Max size of PCB: 510x508
Cleaning of stencil: Automatically using cleaning fluid and vacuum unit at specified intervals
Controll: Optical inspection of HawkEye solder paste application

PICK & PLACE ASSEMBLING MACHINE YAMAHA YSM20R

This ultra-fast modular picking machine can fit boards from 55mm to 810mm. Thanks to a flying camera placed directly on the mounting head, which evaluates data on the picked parts during the moving to the board, the head does not have to travel to a static camera and thus saves time during mounting.

Assembling capacity: 95 000 parts/hour
Max number of spare parts: 128
Accuracy Â±0.025mm
Size of parts: From housing 01005 to 55x100mm
Maximum component height: 15mm

REFLOW SEHO GoReflow 2.3

In the reflow oven the solder paste is melted to tin and thus an intermetallic layer is formed to provide the strength of the brazed joint. Thanks to the flux collection system in the peak and cooling zones, the machine offers minimal maintenance and therefore maximum efficiency.

Lenght of owen: 3.7m
Number of zones: 9
Number of cooling zones: 2

THERMALTRONICS SOLDERING EQUIPMENT

We use the latest soldering technology whose principle is based on induction heating. The induction heating function detects the thermal requirements in given a brazing point and provides a very accurate amount of heat to ensure a reliable brazing at a constant temperature. Induction heating is achieved highest quality soldered joints. Sensitive components are therefore protected from damage.